Industrial High Thermal Conductivity Aluminum Nitride AlN Ceramic Substrate
The main features of the AlN ceramic substrate
1. High thermal conductivity (170 ~220) W/m.k, it's 5~8.5 times higher than that of alumina
2. Similar coefficient of thermal expansion to that of silicon (Si), it helps to achieve high reliability of Si chip
3. High insulation resistance and voltage resistance strength, but low dielectric constant and dielectric loss
4. High mechanical strength, it's up to 450MPa and very dense ceramic body free of porosity
5. It offers very high purity up to 99%, also it's free of toxicity and meets RoHS, REACH regulation
The specification of the AlN Ceramic Substrate
| Optional shape | Round, square, rectangular |
| Typical thickness | 0.38mm, 0.50mm, 0.635mm, 1.0mm, 1.2mm, 1.5mm |
| Dimensions | Max. OD to be up to 400mm, Max. side-length to be 500mm x 400mm |
| Secondary process | Fine flat grinding, CNC machining, Laser cutting, Precision drilling |
| Surface treatment | One-side or double side polished, metalizing, sandblasting |
The description of the AlN ceramic substrate
Our facility has been manufacturing aluminum nitride (AlN) substrate for ages, including a selection of thickness from 0.30mm to 10mm.
With both extremely high thermal conductivity (170-220W/mK) and insulating properties. These ceramic wafers can be the best solution in electronics applications where strict conditions are required, such as power modules (MOSFET, IGBT), LED packages for protecting circuits, cooling, packages, and modules.
Property Datasheet of AlN Ceramic Wafers and Ceramic Substrates
| General | Properties | Unit | Value |
| Mechanical | Purity | % | ≥99 |
| Volume Density | g/cm3 | ≥3.30 |
| Color | | Gray |
| Porosity | % | 0 |
| Compressive Strength | MPa | - |
| Bending Strength | MPa | 450 |
| Elastic Modulus | MPa | 330 |
| Fracture toughness | Mpam1/2 | 3 |
| Thermal | Max. service temperature (Non-loading) | ℃ | 1800 |
| Thermal Conductivity (25℃) | W/m.k | ≥170 |
| Coefficient of Thermal Expansion (CTE) | 1*10-6 m/k | 4.6 |
| Specific heat | 1 x 103J/(kg·K) | 0.74 |
| Electrical | Volume Resistivity (25℃) | ohm.cm | 1*1014 |
| Insulation Breakdown | KV/mm | 25 |
| Dielectric constant (1Mhz) | (E) | 8.7 |
Why choose us?
1.With 15 years of manufacturing experience in OEM, ODM
2. Powerful R&D, customized and mass production capability
3. In-house comprehensive manufacturing types of equipment
4. Rigorous quality control system and processes
FAQs (Frequently Asked Questions)
Q1. Are you a factory or trading company?
A: We are a direct manufacturer of technical ceramic components. You are welcome to visit our factory.
Q2: Is it available to provide customized products?
A: We always support custom-made demand as per different materials, dimensions, and designs.
Q3: When can I get the price?
A: We regularly quote within 24 hours after we get your inquiry. If you are in urgent need of getting the price.
Please call us or tell us in your email so that we will proceed with your inquiry as a priority.
Q4: How to ensure quality?
A: We have a complete strict quality-control system, including IQC, IPQC, QA, OQC per ISO9001: 2008
Q5: What other products are you dealing with?
A: We also focus on a variety of metalized ceramics, high precision zirconia ceramic parts, ceramic seals.
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Aluminum Nitride Aln 3.30g/cm3 Ceramic Substrate Images
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