High Brazing Strength Gold Metallized Ceramic Cover Plate with Au Plating
Main characteristics of the metalized ceramic cover plates:
1. High thermal conductivity, up to 24 W/m.k at room temperature
2. High bonding/brazing strength, It can be up to 150 MPa after brazing
3. High voltage, high current and high-temperature resistance
4. With a low dielectric constant and small dielectric loss
5. High mechanical strength, flexural strength can be up to 338 MPa
6. Smooth surface free of bending, camber, and micro-cracks
7. High reliability under high humidity and high-temperature working environment
8. Easy to be machined with precision dimensions and goods flatness for multiple layers
9. Excellent chemical stability, resistant to most strong acids and alkalis, free of rust forever
10. Low coefficient of thermal expansion, less than 8 x 10 -6 from room temperature to 800℃
11. Sufficient raw material supplying with competitive price
12. Free of any hazardous substances, meet RoHS and REACH regulation fully
Specification of metalized ceramic cover plates:
1. Forming methods: tape casting, slice casting, dry pressing, and ISO pressing
2. Available material: Alumina(Al2O3), Aluminum nitride (AlN) and Beryllia (BeO)
3. Size capability: min. size to be 1mm x 1mm, max. size to be 240mm x 280mm
4. Tolerance: thickness with +/-0.05mm. Length and width with +/-0.5mm or better
5. Surface finish: metalizing, polishing, lapping and so on
6. Secondary process: fine grinding, laser cutting and so on
The classical types of metallization:
1. Ceramic substrate + Silver (Ag) plating
2. Ceramic substrate + Molybedum (Mo-Mn) plating
3. Ceramic substrate + Copper (Cu) plating
Description of metallized ceramic cover plate:
Given the properties of good heat dissipation properties, minimum electric resistance, and vacuum tightness, metalized ceramics are ideal components for high vacuum, high voltage, and high-pressure applications.
By applying a thin metallic coating(general Mo/Mn, or W) as a base layer with high-temperature sintered, Furthermore, plated with Nickel/Silver/Copper/Gold to the surface of the ceramic, the bonding between ceramic parts and metal items can be achieved, which is also known as ceramic metallization.
Tungsten and Moly-Manganese metallizations have higher adhesion to the substrate than Thick-film metallization.
We supply a great of ceramic metalized plates in different technical materials, it mainly includes alumina, aluminum nitride, and beryllia ceramics. These ceramic substrates are shaped by tape casting, ISO pressing or Dry pressing with a very dense body.
A variety of different patterns, different configuration metallized ceramic plates are available to supply via laser cutting, fine grinding and so on. All these metallized ceramic plates offer to tighten tolerance.
Applications:
Widely used in thick film circuits large-scale integrated circuits, hybrid IC, semiconductor packages, chip resistors, networks resistor, focusing potentiometer, power modules, power hybrid circuits and other related fields of electronic industry.
Material Data. Sheet
| General | Property | Units | 99%Al2O3 | 95%Al2O3 | ZrO2 |
| Mechanical | Density | g/cm3 | ≥3.80 | ≥3.60 | ≥6.0 |
| Water absorption | % | 0 | 0 | 0 |
| Hardness | HV | 1700 | 1500 | 1300 |
| Flexural strength | Mpa | ≥338 | ≥320 | ≥1200 |
| Compressive strength | Mpa | ≥2240 | ≥2000 | ≥1990 |
| Fracture toughness | Mpa m 1/2 | 4-5 | 3-4 | 6.5-8 |
| Thermal | Max. service
temperature
(Non-loading) | ℃ | 1600 | 1450 | 1000 |
| CTE (20-800℃) | 1×10 -6 /℃ | 6.2~8.0 | 5.0~8.0 | 8.0~9.5 |
| Thermal shock | T(℃) | ≥200 | ≥220 | ≥300 |
| Thermal conductivity (25℃ ) | W/m.k | 29 | 24 | 3 |
| Specific heat | 1 x 10 3 J/(kg·K) | 0.78 | 0.78 | 0.46 |
| Electrical | Volume resistivity (25℃ ) | ohm.cm | ＞1 x 10 14 | ＞1 x 10 14 | ＞1 x 10 11 |
| Insulation strength | KV/mm | 18 | 18 | 17 |
| Dielectric constant (1Mhz) | (E) | 9.5 | 9.5 | 29 |
Other related metallized ceramic parts
We also produce lots of different types of metalized ceramic parts besides ceramic metallised substrates.
Packaging proposal & Transportation methods
1. Vacuum packing with desiccant as an inner package;
2. Then, exported carton as an outer package.
3. Finally, it will be packed with a wooden case if needed.
4. We regularly use DHL, UPS, FedEx, and TNT to ship small parcels.
5. For large volume orders, we could ship it by sea as per customers' needs.
FAQs( Frequently Asked Questions)
Q1: Is it available to produce customized products?
A: We always support custom-made metallic coated ceramic insulators as per different dimensions, designs, metallization, and platings.
Q2. When can I get the price?
A: We regularly quote within 24 hours after we get your inquiry. If you are in urgent need of getting the price, please call us or tell us in your email so that we will proceed with your inquiry as a priority.
Q3. How long can I expect to get the sample?
A: After you pay the sample charge and send us confirmed files, the samples will be ready for delivery in 4 weeks. The samples will be sent to you via express and arrive in 3-5 workdays. You can use your own express account or prepay us if you do not have an account.
Q4. How long does the whole procedure being worked out?
A: After you place an order, the manufacturing time is about 25 working days.
Q5. How to ensure quality?
A: The dimension out of any batch will be carried out sampling inspection per International AQL standard. A 100% cosmetic inspection will be done.
Q6. Are you a factory or trading company?
A: We are a professional manufacturer. We are warmly welcome clients from worldwide to visit our factory and cooperate with us.
Product Tags:
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Gold Metallized Ceramic Substrates , Ceramic Cover Plates With Au Plating Images
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